Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-12-29
2009-10-06
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257SE25013, C257SE23011, C257S678000, C257S734000, C257S737000, C257S738000, C257S778000, C257S723000, C257S686000, C257S685000, C257S680000, C257S773000, C257S774000
Reexamination Certificate
active
07598617
ABSTRACT:
A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof and connected to bonding pads, through silicon vias which are formed therethrough and connected to the first re-distribution lines, and second re-distribution lines formed on the lower surface thereof and connected to the through silicon vias; first and second solder balls interposed between the first and second re-distribution lines which face each other and between the first re-distribution lines of the lowermost semiconductor chip and electrode terminals of the printed circuit board; a molding material for molding the upper surface of the printed circuit board including the stacked semiconductor chips; and third solder balls attached to ball lands formed on the lower surface of the printed circuit board.
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Notice of Preliminary Rejection from Korean Intellectual Property Office.
Lee Seung Hyun
Suh Min Suk
Hynix / Semiconductor Inc.
Ladas & Parry LLP
Williams Alexander O
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