Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-05-10
2011-05-10
Blum, David S (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S738000, C257SE23069, C257SE25013, C438S109000
Reexamination Certificate
active
07939924
ABSTRACT:
A stacked BGA package and a method for manufacturing the stacked BGA package, with reduced size and/or height of a unit package, which may also reduce an electrical connection length. The stacked BGA package may include a base BGA package having at least one semiconductor chip, and a plurality of BGA packages which are stacked on the base BGA package. A plurality of solder balls may electrically connect the base BGA package and the plurality of BGA packages and may then be sealed to reduce the likelihood of damage.
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Machine Translation of KR2000-0056804.
Korean Office Action dated Sep. 30, 2005 with English translation.
Blum David S
Hall Jessica
Muir Patent Consulting, PLLC
Samsung Electronics Co,. Ltd.
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