Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-08-09
2011-08-09
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000, C257S081000, C257S099000, C257S100000, C257S678000
Reexamination Certificate
active
07994643
ABSTRACT:
A chip stack package may include a substrate, semiconductor chips, a molding member and a controller. The substrate may have a wiring pattern. The semiconductor chips may be stacked on a first surface of the substrate. Further, the semiconductor chips may be electrically connected to the wiring pattern. The molding member may be formed on the first substrate covering the semiconductor chips. The controller may be arranged on a second surface of the substrate. The controller may be electrically connected to the wiring pattern. The controller may have a selection function for selecting operable semiconductor chip(s) among the semiconductor chips.
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Kim Sang-uk
Kim Tae-hun
Kwon Heung-kyu
Andújar Leonardo
Arroyo Teresa M.
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
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