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Circuit structure with W, WC and/or W2C layer on AlN substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature
Reexamination Certificate

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Circuit structure, manufacturing method thereof and wiring...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Circuit structures and methods with BEOL layer(s) configured...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Circuit substrate and its manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Circuit substrate and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Circuit substrate device, method for producing the same,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Circuit substrate having improved connection reliability and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Circuit substrate having post-fed die side power supply...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Circuit substrate including insulating layer of aluminum nitride

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Circuit substrate, circuit device and manufacturing process...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Circuit substrate, circuit-formed suspension substrate, and prod

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Circuit substrate, detector, and method of manufacturing the...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Circuit substrate, semiconductor module and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Circuit substrates, semiconductor packages, and ball grid...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Circuit support for a semiconductor chip and component

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Circuit system with circuit element

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Circuit tape having adhesive film semiconductor device and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Circuit tape having adhesive film, semiconductor device, and a m

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Circuit tape having adhesive film, semiconductor device, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Circuit wafer and TEG test pad electrode

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Patent

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