Circuit substrate, semiconductor module and method of...

Details Circuit substrate, semiconductor module and method of... Circuit substrate, semiconductor module and method of...

2007-03-13

2007-03-13

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S778000, C257S779000, C257S780000, C257S784000

Reexamination Certificate

active

10853286

ABSTRACT:
To enhance bonding accuracy to a lead electrode, while coping with narrowing pitch of the lead electrodes, a lead electrode, whose bonding surface is sharpened, is provided to a film substrate, and a protruding electrode is bonded to the lead electrode, while having a bonding surface of the lead electrode bite into the protruding electrode.

REFERENCES:
patent: 5929521 (1999-07-01), Wark et al.
patent: 2002/0149118 (2002-10-01), Yamaguchi et al.
patent: 2003/0160325 (2003-08-01), Yoneda et al.
patent: 05-063134 (1993-03-01), None

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