Circuit substrate, circuit-formed suspension substrate, and prod

Details Circuit substrate, circuit-formed suspension substrate, and prod Circuit substrate, circuit-formed suspension substrate, and prod

1998-03-06

2000-08-08

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257701, 257702, 428209, H01L 2304

Patent

active

061005827

ABSTRACT:
A circuit substrate having an insulating layer comprising a polyimide resin on a metal foil substrate, wherein the polyimide resin is a polyimide resin obtained by the reaction of

REFERENCES:
patent: 4868584 (1989-09-01), Nikaido et al.
patent: 4970283 (1990-11-01), Kunimune et al.
patent: 5157107 (1992-10-01), Nikaido et al.
patent: 5252703 (1993-10-01), Nakajima et al.
patent: 5578697 (1996-11-01), Kawamonzen et al.
patent: 5665523 (1997-09-01), Omote et al.
patent: 5670609 (1997-09-01), Auman et al.
patent: 5851736 (1998-12-01), Omote et al.
patent: 5858518 (1999-01-01), Omote et al.

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