Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2007-05-01
2007-05-01
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257SE23011
Reexamination Certificate
active
10336728
ABSTRACT:
A circuit substrate comprises a glass substrate16, through-holes18formed through the glass substrate16and via electrodes20buried in the through-holes18. An opening width of the through-holes18is minimum inside the glass substrate and is increased toward both surfaces of the glass substrate16. Accordingly, the detachment of the via electrodes20can be prevented without increasing the surface roughness of the inside walls of the through holes, and stresses generated in the core substrate can be mitigated.
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Omote Koji
Taniguchi Osamu
Yamagishi Yasuo
Armstrong Kratz Quintos Hanson & Brooks, LLP
Dolan Jennifer M
Fujitsu Limited
Jr. Carl Whitehead
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