Circuit substrate and its manufacturing method

Details Circuit substrate and its manufacturing method Circuit substrate and its manufacturing method

2006-08-01

2006-08-01

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S678000, C257S723000

Reexamination Certificate

active

07084512

ABSTRACT:
A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.

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