Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-01-04
2011-01-04
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S698000, C257S700000, C257S701000, C257S702000, C257S703000, C257SE23006, C257SE23011, C257SE23020, C257SE23067, C257SE23079
Reexamination Certificate
active
07863724
ABSTRACT:
A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate.
REFERENCES:
patent: 6137168 (2000-10-01), Kirkman
patent: 6388207 (2002-05-01), Figueroa et al.
patent: 6452117 (2002-09-01), Curcio et al.
patent: 6489682 (2002-12-01), Yeh et al.
patent: 6528872 (2003-03-01), Chang
patent: 6611419 (2003-08-01), Chakravorty
patent: 6650014 (2003-11-01), Kariyazaki
patent: 6900544 (2005-05-01), Boireau
patent: 6941537 (2005-09-01), Jessup et al.
patent: 6943450 (2005-09-01), Fee et al.
patent: 6967398 (2005-11-01), Frech et al.
patent: 7002075 (2006-02-01), Kambe et al.
patent: 7030502 (2006-04-01), Chang
patent: 7035081 (2006-04-01), Nagata et al.
patent: 7120031 (2006-10-01), Chakravorty et al.
patent: 7217370 (2007-05-01), Sugimoto et al.
patent: 7298036 (2007-11-01), Miller et al.
Douriet Daniel
Preda Francesco
Singletary Brian L.
Walls Lloyd A.
Baca Matthew W.
Clark Jasmine J
Harris Andrew M.
International Business Machines - Corporation
Mitch Harris Atty at Law, LLC
LandOfFree
Circuit substrate having post-fed die side power supply... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit substrate having post-fed die side power supply..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit substrate having post-fed die side power supply... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2630666