Circuit substrate, circuit device and manufacturing process...

Details Circuit substrate, circuit device and manufacturing process... Circuit substrate, circuit device and manufacturing process...

2011-06-21

2011-06-21

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S684000

Reexamination Certificate

active

07964957

ABSTRACT:
A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.

REFERENCES:
patent: 3820153 (1974-06-01), Quinn
patent: 5294826 (1994-03-01), Marcantonio et al.
patent: 6028358 (2000-02-01), Suzuki
patent: 7232957 (2007-06-01), Mizutani et al.
patent: 6-79689 (1994-03-01), None
patent: 7-142861 (1995-06-01), None
patent: 10-22630 (1998-01-01), None
patent: 2003-318334 (2003-11-01), None
patent: 10-0613792 (2006-08-01), None

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