Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-08-22
2006-08-22
Nguyen, Cuong (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S690000, C257S687000, C257S684000
Reexamination Certificate
active
07095115
ABSTRACT:
In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
REFERENCES:
patent: 4556896 (1985-12-01), Meddles
patent: 5144412 (1992-09-01), Chang et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5258649 (1993-11-01), Tanaka et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5767446 (1998-06-01), Ha et al.
patent: 5900669 (1999-05-01), Knapp et al.
patent: 6064111 (2000-05-01), Sota et al.
patent: 6107683 (2000-08-01), Castro et al.
patent: 6107689 (2000-08-01), Kozono
patent: 6111315 (2000-08-01), Stearns et al.
patent: 6214645 (2001-04-01), Kim
patent: 6246124 (2001-06-01), Jimarez et al.
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6365979 (2002-04-01), Miyajima
patent: 6379997 (2002-04-01), Kawahara et al.
patent: 6452113 (2002-09-01), Dibene et al.
patent: 6560122 (2003-05-01), Weber
patent: 6580620 (2003-06-01), Kim
patent: 2001/0002321 (2001-05-01), Castro
patent: 2001/0009301 (2001-07-01), Azuma
patent: 2002/0001880 (2002-01-01), Kobayashi et al.
patent: 2002/0074690 (2002-06-01), Huang
patent: 2002/0149104 (2002-10-01), Huang
patent: 404177753 (1992-06-01), None
patent: 11-260954 (1999-09-01), None
Abstract:Types of Soldermasks and their Applications, Merix Corporation, 5 pages (1997).
Technical Information:High Tg Epoxy Molding Compound for BGA Package, Toshiba Chemical Corporation, 6 pages (pre-Jul. 2000).
Microelectronics Packaging Handbook, pp. 560-589 (R. Tummala & E. Rymaszewski 1997).
Kinsman Larry
Reeder Jeff
Wensel Richard
Micro)n Technology, Inc.
Nguyen Cuong
Wells St. John P.S.
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