LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Circuit board, electronic device, and method for producing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Circuit board, lead frame, semiconductor device, and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Circuit board, method for manufacturing the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Circuit board, mounting structure for semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Circuit board-mounted IC package cooling apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Circuit board-mounted IC package cooling apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Circuit board-providing article, circuit board,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Circuit boards containing vias and methods for producing same

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Circuit built-in light-receiving element

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Circuit carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Circuit carrier and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Circuit carrier and package structure thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

Circuit cell based semiconductor integrated circuit device and m

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Circuit chip package and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Circuit component built-in module and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Circuit component built-in module with embedded...

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular chip input/output means

Circuit component placement

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor

Circuit component, circuit component package, circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Circuit configuration