Circuit board, lead frame, semiconductor device, and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

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C257S676000, C257S692000

Reexamination Certificate

active

08039941

ABSTRACT:
A semiconductor device includes: an element mounting member including a first electrode; a semiconductor element mounted on the element mounting member and including a second electrode; and an interposer element mounted on the element mounting member with a first side of the interposer element facing one of a side of the semiconductor element. The interposer element is one of a triangle and a trapezoid in plan view, and includes: a first interposer electrode electrically connected to the second electrode via a first wire; a second interposer electrode electrically connected to the first electrode; and an internal interconnection electrically connecting the first interposer electrode and the second interposer electrode to each other.

REFERENCES:
patent: 5075758 (1991-12-01), Aizawa
patent: 5245216 (1993-09-01), Sako
patent: 2001/0002065 (2001-05-01), Drehobl et al.
patent: 2002/0180022 (2002-12-01), Emoto
patent: 2005/0156305 (2005-07-01), Moriguchi et al.
patent: 2000-227439 (2000-08-01), None

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