Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate
2009-04-14
2011-10-18
Tran, Thien F (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
C257S676000, C257S692000
Reexamination Certificate
active
08039941
ABSTRACT:
A semiconductor device includes: an element mounting member including a first electrode; a semiconductor element mounted on the element mounting member and including a second electrode; and an interposer element mounted on the element mounting member with a first side of the interposer element facing one of a side of the semiconductor element. The interposer element is one of a triangle and a trapezoid in plan view, and includes: a first interposer electrode electrically connected to the second electrode via a first wire; a second interposer electrode electrically connected to the first electrode; and an internal interconnection electrically connecting the first interposer electrode and the second interposer electrode to each other.
REFERENCES:
patent: 5075758 (1991-12-01), Aizawa
patent: 5245216 (1993-09-01), Sako
patent: 2001/0002065 (2001-05-01), Drehobl et al.
patent: 2002/0180022 (2002-12-01), Emoto
patent: 2005/0156305 (2005-07-01), Moriguchi et al.
patent: 2000-227439 (2000-08-01), None
McDermott Will & Emery LLP
Panasonic Corporation
Tran Thien F
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