Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2005-02-08
2005-02-08
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S778000, C257S737000
Reexamination Certificate
active
06853092
ABSTRACT:
The present invention provides a circuit board including a plurality of pads for mounting a semiconductor device with bumps and a plurality of wires drawn from the respective pads, a mounting structure for the semiconductor device with bumps, and an electro-optic device and an electronic device. The circuit board has a region where the pitch in the longitudinal direction and the lateral direction of the plurality of pads are different from each other and the wires are preferentially drawn from a wider pitch side of the longitudinal direction or the lateral directions of the pads.
REFERENCES:
patent: 10-290058 (1998-10-01), None
Harness & Dickey & Pierce P.L.C.
Potter Roy
Seiko Epson Corporation
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