Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-01-18
1997-04-29
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257714, 361699, 361719, H01L 2334
Patent
active
056252277
ABSTRACT:
In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes. In another embodiment of the assembly, the circuit board through holes are replaced with a circuit board opening through which a heat sink structure passes, the heat sink structure being thermally coupled on one side thereof to the die cavity lid. The other side of the heat sink structure engages a metal chassis section which interiorly engages the outer plastic housing wall of a computer.
REFERENCES:
patent: 4396936 (1983-08-01), McIver et al.
patent: 5270572 (1993-12-01), Nakajima et al.
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5373417 (1994-12-01), Barrett
patent: 5448108 (1995-09-01), Quon et al.
patent: 5455458 (1995-10-01), Quon et al.
Estes Scott
Swamy Deepak
Crane Sara W.
Dell USA L.P.
Ostrowski David
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