Circuit carrier

Details Circuit carrier Circuit carrier

2006-10-24

2006-10-24

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S734000, C257S737000, C257S738000, C257S778000, C257S779000, C257S795000

Reexamination Certificate

active

07126211

ABSTRACT:
The present invention provides a circuit carrier for connecting to at least a bump. The circuit carrier comprises a substrate, at least a contact pad on a surface of the substrate and a solder mask layer covering the substrate. The solder mask has at least a stepped opening that exposes a portion of the contact pad. The stepped opening includes at least a first opening and a second opening and the size of the first opening is larger than that of the second opening. The stepped opening of the solder mask layer can contain more pre-solder paste, thus increasing the bonding strength between the bump and the contact pad.

REFERENCES:
patent: 6573610 (2003-06-01), Tsai
patent: 6673711 (2004-01-01), Tong et al.
patent: 6678948 (2004-01-01), Benzler et al.
patent: 2003/0127734 (2003-07-01), Lee et al.

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