Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2004-09-24
2008-08-12
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257SE23004, C257SE23173, C257SE23177, C257SE27112, C257S786000, C257S668000, C257S700000, C257S701000, C257S758000, C257S203000, C257S208000, C257S211000, C257SE23079, C438S613000, C438S666000
Reexamination Certificate
active
07411295
ABSTRACT:
A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern.
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Fujitsu Limited
Westerman, Hattori, Daniels & Adrian , LLP.
Williams Alexander O
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