Circuit board, method for manufacturing the same, and...

Details Circuit board, method for manufacturing the same, and... Circuit board, method for manufacturing the same, and...

2007-05-14

2011-11-22

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S783000, C257SE21135, C228S180210

Reexamination Certificate

active

08063486

ABSTRACT:
A circuit board1having a base material10and an electrode11formed on at least one main surface of the base material10includes an easy peeling portion12formed in at least one of an inner portion and a side portion of the electrode11, with the adhesive strength between the electrode11and the easy peeling portion12being less than the adhesive strength between the electrode11and the base material10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.

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patent: 5956236 (1999-09-01), Corisis et al.
patent: 6073829 (2000-06-01), Pienimaa
patent: 6181569 (2001-01-01), Chakravorty
patent: 6959856 (2005-11-01), Oh et al.
patent: 7026721 (2006-04-01), Chen
patent: 2004/0262372 (2004-12-01), Houle et al.
patent: 2006/0043608 (2006-03-01), Bernier et al.
patent: 10-209203 (1998-08-01), None
patent: 11-87424 (1999-03-01), None

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