LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Chip-scaled MEMS microphone package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Chip-scaled package having a sealed connection wire

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip-size integrated circuit package having slits formed in...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Chip-size package piezoelectric component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Chip-size package semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Chip-size package structure and method of the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Chip-size package structure and method of the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Chip-size semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Chip-size semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Chip-size semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip-sized package having metal circuit substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Chip-stacked package structure having leadframe with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip-stacked semiconductor package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip-stacked semiconductor package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Chip-to-chip trench circuit structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Chip-to-chip trench circuit structure

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Chip-type composite electronic component and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip-type electronic component having external electrodes...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip-type electronic component including thin-film circuit...