Chip-scaled package having a sealed connection wire

Details Chip-scaled package having a sealed connection wire Chip-scaled package having a sealed connection wire

2005-12-06

2005-12-06

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S784000

Reexamination Certificate

active

06972496

ABSTRACT:
A chip-scaled package and manufacturing method thereof including a semiconductor chip having a chip pad thereon, a first insulating layer formed on the semiconductor chip and having an opening part exposing the chip pad, a metal wire of which one end covers the opening part so as to be electrically connected to the chip pad202, a second insulating layer on the first insulating layer including the opening part, the second insulating layer exposing the other end of the metal wire, a conductive ball formed on the other end of the exposed metal wire, and a substrate on which the ball is to be mounted, thereby enabling to improve a package reliance by decreasing the scale and weight of the package.

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