Chip-sized package having metal circuit substrate

Details Chip-sized package having metal circuit substrate Chip-sized package having metal circuit substrate

1995-11-30

1997-11-04

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257778, 257784, 257787, H01L 2348, H01L 2352

Patent

active

056843305

ABSTRACT:
A chip-sized semiconductor package having a semiconductor chip formed with bonding pads; a circuit board provided with contact pads for electrically connecting the circuit board to external terminals, and circuit patterns for electrically connecting the circuit board to the chip; a tape bonding the circuit board to the chip; and wires electrically connecting the circuit board to the bonding pads on the chip; the package being encapsulated by a molding compound so that a part of a surface of the circuit board where the contact pads are formed is exposed.

REFERENCES:
patent: 4819041 (1989-04-01), Redmond
patent: 4916519 (1990-04-01), Ward
patent: 5233220 (1993-08-01), Lamson et al.
patent: 5359224 (1994-10-01), Heinen et al.
patent: 5363279 (1994-11-01), Cha
patent: 5442231 (1995-08-01), Miyamoto et al.
patent: 5519251 (1996-05-01), Sato et al.

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