Chip-size package piezoelectric component

Details Chip-size package piezoelectric component Chip-size package piezoelectric component

2006-05-09

2006-05-09

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

C257S415000, C257S416000, C257S420000, C257SE27006, C310S328000, C310S348000, C029S025350

Reexamination Certificate

active

07042056

ABSTRACT:
A surface acoustic wave device includes a SAW having an IDT disposed on a piezoelectric substrate, a conductive pad connected to the IDT, and a bonding substrate, wherein the SAW is bonded to the bonding substrate such that a protective space of the IDT is provided. The bonding substrate includes a through-hole in which an external terminal connection member connected to the conductive pad and an external terminal are disposed. The SAW is bonded to the bonding substrate by an adhesive layer including a solder layer.

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