Chip-scaled MEMS microphone package

Details Chip-scaled MEMS microphone package Chip-scaled MEMS microphone package

2008-07-29

2010-10-12

Thai, Luan C (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S415000, C257S414000, C257S416000, C381S174000

Reexamination Certificate

active

07812418

ABSTRACT:
An MEMS microphone package includes a circuit board and an MEMS microphone chip. The MEMS microphone chip, mounted on the circuit board, includes a substrate, an MEMS transducer formed on the substrate, and a readout circuit also formed on the substrate. The MEMS transducer generates a sound signal according to sound pressure variations. The readout circuit reads the sound signal from the MEMS transducer.

REFERENCES:
patent: 5490220 (1996-02-01), Loeppert
patent: 5856914 (1999-01-01), O'Boyle
patent: 6178249 (2001-01-01), Hietanen et al.
patent: 6870939 (2005-03-01), Chiang et al.
patent: 7466834 (2008-12-01), Ogura et al.

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