4. Active solid-state devices (e.g., transistors, solid-state diode
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Chip scale packaging technique for optical image sensing...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Chip scale packaging with improved heat dissipation capability

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Chip scale packaging with multi-layer flip chip arrangement...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Chip scale pin array

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
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Chip scale stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Chip scale surface mount package for semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
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Chip scale surface mount package for semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Chip scale surface mount package for semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
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Chip scale surface mounted device and process of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Chip scale surface mounted device and process of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip select method through double bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Chip shaping for flip-chip light emitting diode

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With heterojunction
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Chip size image sensor bumped package

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Chip size image sensor camera module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Chip size integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Chip size package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
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Chip size package and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Chip size package having concave pattern in the bump pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Chip size package semiconductor device and method of forming...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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Chip size package with stress relieving internal terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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