Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-12-27
2005-12-27
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S432000, C257S433000
Reexamination Certificate
active
06979902
ABSTRACT:
An image sensor camera module includes a dielectric flex tape and a semiconductor die including an imager array. Die attach pads are formed along one edge of the die. The dielectric flex tape overlaps either the top or the bottom of the die, and connections between the die and the tape are made using solder bumps or wire bonds, for example. No supporting substrate other than the tape is required. A lensing structure can be attached directly to the die.
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patent: 6768516 (2004-07-01), Yamada et al.
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patent: 2003/0223008 (2003-12-01), Kim et al.
patent: 2004/0027477 (2004-02-01), Tamura et al.
patent: 2004/0188838 (2004-09-01), Okada et al.
Dickstein , Shapiro, Morin & Oshinsky, LLP
Ho Tu-Tu
Micro)n Technology, Inc.
Nelms David
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