Chip select method through double bonding

Details Chip select method through double bonding Chip select method through double bonding

2007-01-30

2007-01-30

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S786000, C326S041000

Reexamination Certificate

active

10134764

ABSTRACT:
A chip generally comprising a logic circuit and a plurality of pads. The logic circuit may be configured to operate in a plurality of modes in response to a mode signal. The pads may be configurable into a plurality of subsets such that one of the subsets is used by the logic circuit at a time in response to the mode signal.

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