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Chip module with a plurality of flat contact elements...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip module with bond-wire connections with small loop height

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Chip module with conductor paths on the chip bonding side of a c

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent

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Chip mounting plate construction of lead frame for semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Chip mounting scheme

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Chip mounting structure having adhesive conductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Chip mounting substrate, first level assembly, and second...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Chip on board assembly without wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Chip on board leadframe for semiconductor components having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip on board package for imager

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Chip on board package for optical mice and lens cover for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Chip on board package with top and bottom terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Chip on board with heat sink attachment

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Chip on board with heat sink attachment and assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Chip on chip device including basic chips capable of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Chip on chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Chip on film (COF) package having test pad for testing...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Heterojunction formed between semiconductor materials which...
Reexamination Certificate

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Chip on glass package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Chip on lead frame for small package speed sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Chip on photosensitive device package structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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