Chip on board assembly without wire bonding

Details Chip on board assembly without wire bonding Chip on board assembly without wire bonding

1997-05-23

1999-04-06

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257673, 257672, 257786, 29827, H01L 2350, H01L 2348

Patent

active

058922709

ABSTRACT:
An apparatus and method of attaching I/O pads of an integrated circuit die to package leads. The attachment is made using conventional assembly processes but without using wire bonding. A leadframe with lead fingers is formed and the lead fingers are aligned with bumps extending from the I/O pads. A connection is made by physical contact, laser spot welding, or other coupling techniques.

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patent: 5530282 (1996-06-01), Tsuji
patent: 5661336 (1997-08-01), Phelps, Jr. et al.
patent: 5677567 (1997-10-01), Ma et al.
patent: 5693565 (1997-12-01), Comilletti et al.
patent: 5726490 (1998-03-01), Moroi

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