Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Heterojunction formed between semiconductor materials which...
Reexamination Certificate
2002-02-01
2008-10-28
Menz, Laura M (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Heterojunction device
Heterojunction formed between semiconductor materials which...
C257S668000, C257S730000
Reexamination Certificate
active
07442968
ABSTRACT:
A chip on film (COF) package comprising a test pad for testing the electrical function of a semiconductor chip and a method for manufacturing same are provided. The COF package comprises a semiconductor chip mounted on a base film, a signal-input portion for receiving data and control signals and transmitting the data and control signals to the semiconductor chip, a plurality of passive elements connected to terminals of the semiconductor chip, and a plurality of test pads for testing one or more terminals of the semiconductor chip that are not connected to the signal-input portion. The test pads of the COF package are capable of testing a plurality of internal terminals which are integrated into one terminal and do not connected to the signal-input portion, thereby easily testing the electrical function of the chip.
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Jung Ye-jung
Kim Hyoung-ho
F. Chau & Assoc., LLC.
Menz Laura M
Samsung Electronics Co,. Ltd.
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