Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1995-12-12
1997-08-26
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257672, 257674, 257670, 257711, 257649, H01L 2348, H01L 2312, H01L 2350, H01L 2328
Patent
active
056613385
ABSTRACT:
A chip mounting plate construction of lead frames for semiconductor packages which provides a chip mounting plate having a greatly reduced area to obtain a small bonding area between the chip mounting plate and a semiconductor chip mounted on the chip mounting plate, thereby capable of minimizing thermal strain generated at the chip mounting plate due to a thermal expansion thereof. The chip mounting plate is constructed to have a smaller area than the semiconductor chip, to have a central opening, or to have recesses.
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Han In Gyu
Lee Jeong
Park Doo Hyun
Yoo Hee Yeoul
Yoo Youn Cheol
Amkor Electronics, Inc.
Anam Industrial Co., Ltd.
Crane Sara W.
MacDonald Thomas S.
Williams Alexander Oscar
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