Chip on chip device including basic chips capable of...

Details Chip on chip device including basic chips capable of... Chip on chip device including basic chips capable of...

2004-02-27

2008-12-16

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE25013

Reexamination Certificate

active

07466029

ABSTRACT:
In a wafer, a plurality of basic chips F is arranged therein. The basic chip F has a memory capacity of i-mega bytes. By dicing, a memory chip including four basic chips F is cut out of the wafer. The memory chip has a memory capacity of 4×i-mega bytes. A dicing line is interposed between four basic chips F configuring the memory chip, Four basic chips F can change word organization by a control signal individually.

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Tadahiko Sugibayashi, et al., “A 1Gb DRAM for File Applications”, ISSCC Digest of Technical Papers, 1995, pp. 254-255.

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