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Chip carrier with embedded leads and chip package using same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Chip carrier with magnetic shielding

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Chip carrier with oxidation protection layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Chip carrier with peripheral stiffener and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Patent

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Chip carrier with reduced interference signal sensitivity

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Chip carrier, semiconductor package and fabricating method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip circuit comprising an inductor

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Chip CMOS optical element

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate

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Chip component and method for producing a chip component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Chip cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Chip cooling channels formed in wafer bonding gap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Chip cooling system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Chip cover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Chip crack stop design for semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Chip damage detecting circuit for semiconductor IC

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Patent

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Chip decoupling capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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Chip decoupling capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Chip decoupling capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent

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Chip design with power rails under transistors

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor
Reexamination Certificate

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Chip edge interconnect apparatus and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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