4. Active solid-state devices (e.g., transistors, solid-state diode
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Adhesion by plasma conditioning of semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Adhesion by plasma conditioning of semiconductor chip surfaces

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Adhesion enhanced semiconductor die for mold compound packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Adhesion enhanced semiconductor die for mold compound packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Adhesion layer for a polymer memory device and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material
Reexamination Certificate

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Adhesion of copper and etch stop layer for copper alloy

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Adhesion of silicon carbide films

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Adhesion of tungsten nitride films to a silicon surface

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Adhesion resistant micromachined structure and coating

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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Adhesive and semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Adhesive composition and methods for use in packaging...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Adhesive composition for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Adhesive composition, semiconductor device using the composition

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Adhesive containing a filler, and a method for attaching and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Adhesive film and tacking pads for printed wiring assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Adhesive film composition, associated dicing die bonding...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Adhesive film for manufacturing semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Adhesive film for semiconductor, lead frame and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Adhesive film for semiconductor, lead frame and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Adhesive film for semiconductor, lead frame and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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