Adhesive film composition, associated dicing die bonding...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S327000, C156S330000, C428S3550EP, C428S413000, C428S414000, C428S480000, C523S400000, C525S438000, C525S533000

Reexamination Certificate

active

07863758

ABSTRACT:
An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.

REFERENCES:
patent: 5183592 (1993-02-01), Ichimura et al.
patent: 7008981 (2006-03-01), Liu et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Adhesive film composition, associated dicing die bonding... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive film composition, associated dicing die bonding..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive film composition, associated dicing die bonding... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2665957

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.