Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2011-01-04
2011-01-04
Feely, Michael J (Department: 1796)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C156S327000, C156S330000, C428S3550EP, C428S413000, C428S414000, C428S480000, C523S400000, C525S438000, C525S533000
Reexamination Certificate
active
07863758
ABSTRACT:
An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
REFERENCES:
patent: 5183592 (1993-02-01), Ichimura et al.
patent: 7008981 (2006-03-01), Liu et al.
Chung Chang Bum
Ha Kyoung Jin
Hong Yong Woo
Im Su Mi
Jeong Chul
Cheil Industries Inc.
Feely Michael J
Lee & Morse P.C.
LandOfFree
Adhesive film composition, associated dicing die bonding... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive film composition, associated dicing die bonding..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive film composition, associated dicing die bonding... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2665957