Adhesion of copper and etch stop layer for copper alloy

Details Adhesion of copper and etch stop layer for copper alloy Adhesion of copper and etch stop layer for copper alloy

2005-08-11

2008-10-28

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S762000, C257S774000

Reexamination Certificate

active

07443029

ABSTRACT:
A new method and structure is provided for the creation of a copper dual damascene interconnect. A dual damascene structure is created in the layer of dielectric, optionally a metal barrier layer is deposited over exposed surfaces of the dual damascene structure. A copper seed layer is deposited, the dual damascene structure is filled with copper. An anneal is applied to the created copper interconnect after which excess copper is removed from the dielectric. Of critical importance to the invention, a thin layer of oxide is then deposited as a cap layer over the copper dual damascene interconnect, an etch stop layer is then deposited over the thin layer of oxide for continued upper-level metallization.

REFERENCES:
patent: 6054769 (2000-04-01), Jeng
patent: 6169028 (2001-01-01), Wang et al.
patent: 6274499 (2001-08-01), Gupta et al.
patent: 6309970 (2001-10-01), Ito et al.
patent: 6346479 (2002-02-01), Woo et al.
patent: 6348407 (2002-02-01), Gupta et al.
patent: 6365502 (2002-04-01), Paranjpe et al.
patent: 6406996 (2002-06-01), Bernard et al.
patent: 6426293 (2002-07-01), Wang et al.
patent: 6706629 (2004-03-01), Lin et al.
patent: 6806192 (2004-10-01), Lin et al.
patent: 6943111 (2005-09-01), Lin et al.
patent: 2001/0027083 (2001-10-01), Farkas et al.

Affiliated with

Also associated with

Rating

Adhesion of copper and etch stop layer for copper alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesion of copper and etch stop layer for copper alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesion of copper and etch stop layer for copper alloy will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3989883