Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-05-27
2008-05-27
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257SE23031
Reexamination Certificate
active
07378722
ABSTRACT:
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.
REFERENCES:
patent: 5200362 (1993-04-01), Lin et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5665473 (1997-09-01), Okoshi et al.
patent: 5673123 (1997-09-01), Dickinson
patent: 5729049 (1998-03-01), Corisis et al.
patent: 5844315 (1998-12-01), Melton et al.
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5922167 (1999-07-01), Rosenfeld
patent: 5932345 (1999-08-01), Furutani et al.
patent: 5977615 (1999-11-01), Yamaguchi et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6117710 (2000-09-01), Mostafazadeh et al.
patent: 6291274 (2001-09-01), Oida et al.
patent: 6348729 (2002-02-01), Li et al.
patent: 6429047 (2002-08-01), Huang
patent: 6523446 (2003-02-01), Tanabe et al.
patent: 6534849 (2003-03-01), Gang
patent: 6558500 (2003-05-01), Matsuura et al.
patent: 6558791 (2003-05-01), Matsuura et al.
patent: 6596677 (2003-07-01), Machac et al.
patent: 6646339 (2003-11-01), Ku et al.
patent: 6717248 (2004-04-01), Shin et al.
patent: 6733880 (2004-05-01), Tanabe et al.
patent: 6744133 (2004-06-01), Tanabe et al.
patent: 7095054 (2006-08-01), Fjelstad
patent: 2004/0038451 (2004-02-01), Hawks et al.
patent: 2005/0255278 (2005-11-01), Matsuura et al.
patent: 03-094460 (1991-04-01), None
patent: 5-129473 (1993-05-01), None
patent: 08-157599 (1996-06-01), None
patent: 2547823 (1996-08-01), None
patent: 10-12773 (1998-01-01), None
patent: 10-056122 (1998-02-01), None
patent: 10-077353 (1998-03-01), None
patent: 11-246685 (1999-09-01), None
patent: 11-251504 (1999-09-01), None
patent: 11-291391 (1999-10-01), None
patent: WO98/15975 (1998-04-01), None
patent: WO99/04432 (1999-01-01), None
Office Action dated Apr. 20, 2004, for Korean Application No. 10-2002-0035194 and the Divisional Application No. 10-2002-7005557.
JP No. 10-56122, Human-generated English translation of JP No. 10-56122, dated Feb. 24, 1998.
Kawai Toshiyasu
Matsuura Hidekazu
Antonelli, Terry Stout & Kraus, LLP.
Hitachi Chemical Co. Ltd.
Zarneke David A.
LandOfFree
Adhesive film for semiconductor, lead frame and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive film for semiconductor, lead frame and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive film for semiconductor, lead frame and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2772482