Adhesive film for manufacturing semiconductor device

Details Adhesive film for manufacturing semiconductor device Adhesive film for manufacturing semiconductor device

2006-11-07

2006-11-07

Lee, Eddie C. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S782000, C257S789000, C257S785000, C257S784000, C257S666000, C257S787000, C257S678000

Reexamination Certificate

active

07132755

ABSTRACT:
An adhesive film for manufacturing a semiconductor device comprising a thermosetting adhesive layer and a heat-resistant backing layer, wherein the adhesive film is applied to a method for manufacturing a semiconductor device, comprising the steps of (a) embedding at least a part of a conductor in the adhesive film to form a conductor adhered thereto; (b) mounting a semiconductor chip on the conductor; (c) connecting the semiconductor chip to the conductor; (d) encapsulating the semiconductor chip with an encapsulation resin; and (e) removing the adhesive film therefrom. The adhesive film can be suitably used for manufacturing a semiconductor device having a so-called standoff wherein a part of a conductor is projecting from an encapsulation resin.

REFERENCES:
patent: 5900676 (1999-05-01), Kweon et al.
patent: 6404643 (2002-06-01), Chung
patent: 2003/0190466 (2003-10-01), Nakaba et al.
patent: 09-252014 (1997-09-01), None
patent: 2000-294580 (2000-10-01), None

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