Adhesive composition, semiconductor device using the composition

Details Adhesive composition, semiconductor device using the composition Adhesive composition, semiconductor device using the composition

1996-12-03

1998-12-01

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257789, 257791, 257792, H01L 23053

Patent

active

058443096

ABSTRACT:
An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.

REFERENCES:
patent: 4535350 (1985-08-01), Goodrich et al.
patent: 4926239 (1990-05-01), Fujima et al.
patent: 4951122 (1990-08-01), Tsubosaki et al.
patent: 5399805 (1995-03-01), Tyler et al.
patent: 5656857 (1997-08-01), Kishita
patent: 5679978 (1997-10-01), Kawahara et al.

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