Adhesive containing a filler, and a method for attaching and...

Details Adhesive containing a filler, and a method for attaching and... Adhesive containing a filler, and a method for attaching and...

2011-01-11

2011-01-11

Feely, Michael J (Department: 1761)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C156S330000, C257S679000, C428S414000, C428S416000, C523S440000

Reexamination Certificate

active

07868435

ABSTRACT:
An adhesive comprises a base material which generates adhesive strength through curing, a hardening agent which promotes the curing of the base material, and a filler. In order to solve the problems mentioned above, the adhesive is made of particles having a maximum particle diameter of 0.8 μm or less.

REFERENCES:
patent: 2002/0070048 (2002-06-01), Kumakura
patent: 05-059158 (1993-03-01), None
patent: 06-025512 (1994-02-01), None
patent: 06-136341 (1994-05-01), None
patent: 09-102567 (1997-04-01), None
patent: 10-294403 (1998-11-01), None
patent: 11-066953 (1999-03-01), None
patent: 2000-003987 (2000-01-01), None
patent: 2001-298147 (2001-10-01), None
Machine translation of JP 11-066953 A, provided by the JPO website (1999).
Partial translation of JP 11-066953 A (paragraphs 0026-0028), provided by the USPTO translations branch.
Machine translation of JP 10-294403 A, provided by the JPO website.
Machine translation of JP 2001-298147 A, provided by the JPO website.

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