Adhesive film for semiconductor, lead frame and...

Details Adhesive film for semiconductor, lead frame and... Adhesive film for semiconductor, lead frame and...

2006-06-06

2006-06-06

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C428S343000

Reexamination Certificate

active

07057266

ABSTRACT:
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.

REFERENCES:
patent: 5665473 (1997-09-01), Okoshi et al.
patent: 5922167 (1999-07-01), Rosenfeld
patent: 5932345 (1999-08-01), Furutani et al.
patent: 6523446 (2003-02-01), Tanabe et al.
patent: 6558500 (2003-05-01), Matsuura et al.
patent: 6558791 (2003-05-01), Matsuura et al.
patent: 6733880 (2004-05-01), Tanabe et al.
patent: 6744133 (2004-06-01), Tanabe et al.
patent: 2005/0255278 (2005-11-01), Matsuura et al.
patent: 03-094460 (1991-04-01), None
patent: 5-129473 (1993-05-01), None
patent: 08-157599 (1996-06-01), None
patent: 10-12773 (1998-01-01), None
patent: 11-246685 (1999-09-01), None
patent: 11-251504 (1999-09-01), None
Office Action dated Apr. 20, 2004, for Korean Application No. 10-2002-0035194 and the Divisional Application No. 10-2002-7005557.

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