Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-05-27
2008-05-27
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257SE23031
Reexamination Certificate
active
11347204
ABSTRACT:
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.
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Kawai Toshiyasu
Matsuura Hidekazu
Hitachi Chemical Co. Ltd.
Zarneke David A.
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