Adhesion enhanced semiconductor die for mold compound packaging

Details Adhesion enhanced semiconductor die for mold compound packaging Adhesion enhanced semiconductor die for mold compound packaging

1996-10-18

1998-06-02

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257672, 257666, 257673, 257677, 257753, 257762, 257769, 257796, H01L 2348, H01L 2352

Patent

active

057604681

ABSTRACT:
A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound during encapsulation. The increased adhesion reduces delamination potential of the die from the package.

REFERENCES:
patent: 3686539 (1972-08-01), Schwartzman
patent: 3902148 (1975-08-01), Drees et al.
patent: 4024570 (1977-05-01), Hartmann et al.
patent: 5227661 (1993-07-01), Heinen
patent: 5313102 (1994-05-01), Lim et al.
patent: 5360991 (1994-11-01), Abys et al.
patent: 5449951 (1995-09-01), Parthasarathi et al.
patent: 5576577 (1996-11-01), Takenouchi et al.
patent: 5583372 (1996-12-01), King et al.

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