LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

Bulk charge modulated device photocell

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

Bulk charge modulated device photocell with lateral charge drain

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Bulk FinFET device

Active solid-state devices (e.g. – transistors – solid-state diode – Including semiconductor material other than silicon or... – Group iii-v compound

Bulk nitride mono-crystal including substrate for epitaxy

Active solid-state devices (e.g. – transistors – solid-state diode – Including semiconductor material other than silicon or... – Group iii-v compound

Bulk nitride mono-crystal including substrate for epitaxy

Active solid-state devices (e.g. – transistors – solid-state diode – Including semiconductor material other than silicon or... – Group iii-v compound

Bulk nitride mono-crystal including substrate for epitaxy

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Bulk non-planar transistor having strained enhanced mobility...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Bulk silicon voltage plane for SOI applications

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device

Bulk single crystal gallium nitride and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With thin active central semiconductor portion surrounded by...

Bulk substrates in FinFETs with trench insulation...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...

Bulk-isolated PN diode and method of forming a bulk-isolated...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...

Bulk-isolated PN diode and method of forming a bulk-isolated...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...

Bulk-isolated PN diode and method of forming a bulk-isolated...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...

Bulk-isolated PN diode and method of forming a bulk-isolated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Bump bonding and sealing a semiconductor device with solder

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bump chip scale semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Bump comprising protuberances and a method of forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Bump electrode for connecting electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Bump electrode structure and semiconductor chip having the same