Bump comprising protuberances and a method of forming the same

Details Bump comprising protuberances and a method of forming the same Bump comprising protuberances and a method of forming the same

1997-08-08

1998-12-01

Meier, Stephen

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257780, 257 57, H01L 2348, H01L 2352, H01L 2940, H01L 2904

Patent

active

058443142

ABSTRACT:
A bump structure with a recessed portion, as defined by a projection, which collects conductive balls suspended in an ACF when forming a bond between an IC and a liquid crystal panel using the chip-on-glass method. The bump structure improves the electrical contact between the bump and the pad, as well reduce the migration of conductive balls into open areas between aligned bumps during the bonding process.

REFERENCES:
patent: 5042919 (1991-08-01), Yabu et al.
patent: 5084961 (1992-02-01), Yoshikawa

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