Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-08-08
1998-12-01
Meier, Stephen
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257780, 257 57, H01L 2348, H01L 2352, H01L 2940, H01L 2904
Patent
active
058443142
ABSTRACT:
A bump structure with a recessed portion, as defined by a projection, which collects conductive balls suspended in an ACF when forming a bond between an IC and a liquid crystal panel using the chip-on-glass method. The bump structure improves the electrical contact between the bump and the pad, as well reduce the migration of conductive balls into open areas between aligned bumps during the bonding process.
REFERENCES:
patent: 5042919 (1991-08-01), Yabu et al.
patent: 5084961 (1992-02-01), Yoshikawa
LG Electronics Inc.
Meier Stephen
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