Bump electrode structure and semiconductor chip having the same

Details Bump electrode structure and semiconductor chip having the same Bump electrode structure and semiconductor chip having the same

1992-10-28

1994-02-22

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257781, H01L 2906, H01L 2348, H01L 2946, H01L 2962

Patent

active

052890384

ABSTRACT:
A concave portion having a V-shaped cross section is dug in a semiconductor region of a chip, and a surface of the semiconductor region inclusive of the concave portion is covered with an insulation film. A wiring film connected to an integrated circuit device is disposed on the insulation film. A protection film covering the surface of the chip is provided with a window to expose the concave portion and a portion of the wiring film. The window is covered with a thin metal subbing film connected to the wiring film. A metal protrusion for a bump electrode is provided by an electroplating process so as to protrude from the concave portion.

REFERENCES:
patent: 3577037 (1971-05-01), DiPietro
patent: 3839727 (1974-10-01), Herdzik et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4163988 (1979-08-01), Yeh et al.

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