Bulk substrates in FinFETs with trench insulation...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With thin active central semiconductor portion surrounded by...

Reexamination Certificate

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C257S622000

Reexamination Certificate

active

10938436

ABSTRACT:
A finFET device includes a semiconductor substrate having specific regions surrounded with a trench. The trench is filled with an insulating layer, and recess holes are formed within the specific regions such that channel fins are formed by raised portions of the semiconductor substrate on both sides of the recess holes. Gate lines are formed to overlie and extend across the channel fins. Source/drain regions are formed at both ends of the channel fins and connected by the channel fins. Other embodiments are described and claimed.

REFERENCES:
patent: 5998845 (1999-12-01), Ludikhuize
patent: 6413802 (2002-07-01), Hu et al.
patent: 6548859 (2003-04-01), Maegawa
patent: 6642090 (2003-11-01), Fried et al.
patent: 6750095 (2004-06-01), Bertagnoll et al.
patent: 6914277 (2005-07-01), Hill et al.
patent: 6963104 (2005-11-01), Wu et al.
patent: 6989308 (2006-01-01), Furukawa et al.
patent: 2004/0110331 (2004-06-01), Yeo et al.
patent: 2005/0035415 (2005-02-01), Yeo et al.
patent: 63-094668 (1988-04-01), None
patent: 2001-0075236 (2001-08-01), None
patent: 2002-0018059 (2002-03-01), None
patent: 2003-0065631 (2003-08-01), None
English language abstract of Korean Publication No. 2001-0075236, Aug. 9, 2001.
English language abstract of Japanese Publication No. 63-094668, Apr. 25, 1988.
English language abstract of Korean Publication No. 2002-0018059, Mar. 7, 2002.
English language abstract of Korean Publication No. 2003-0065631, Aug. 9, 2003.

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