Bump electrode for connecting electronic components

Details Bump electrode for connecting electronic components Bump electrode for connecting electronic components

1994-11-18

1995-12-19

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257778, 257779, H01L 21283, H01L 23482, H01L 2943

Patent

active

054770874

ABSTRACT:
The present invention relates to connecting electronic components using bump electrodes to connect electronic components such as semiconductors with the patterning electrodes of a circuit board. In order to prevent deterioration in connecting reliability due to deformation and the like of semiconductors and circuit boards, it is necessary to have some elasticity incorporated within bump electrodes. The bump electrodes disclosed by the present invention have resin bumps with numerous cavities disposed within and covered by a low melting point metal layer. According to this composition, even when there are some variations of distribution in circuit board warp and bump electrode height, it is possible to absorb the variations through the elasticity presented by the bump electrodes. It is also possible to perform a low strain connection with a resultant enhancement in connecting reliability at high temperature.

REFERENCES:
Translation of Japan Kokai Publication #04-006841 (Jan. 10, 1992) to Saito et al. 11 pages.

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