Using chip lamination to couple an integrated circuit with a...

Using electrically programmable fuses to hide architecture,...

Using epitaxially grown wells for reducing junction...

Using external radiators with electroosmotic pumps for...

Using external radiators with electroosmotic pumps for...

Using floating fill metal to reduce power use for proximity...

Using high-k dielectrics in isolation structures method,...

Using implants to lower anneal temperatures

Using metal/metal nitride bilayers as gate electrodes in...

Using metal/metal nitride bilayers as gate electrodes in...

Using multiple coulomb islands to reduce voltage stress

Using multiple types of phosphor in combination with a light...

Using oxynitride spacer to reduce parasitic capacitance in...

Using polysilicon fuse for IC programming

Using selective deposition to form phase-change memory cells

Using selective deposition to form phase-change memory cells

Using sense lines to thermally control the state of an MRAM

Using unstable nitrides to form semiconductor structures

Utilization of die active surfaces for laterally extending...

Utilization of die active surfaces for laterally extending...