Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-11-09
2009-08-18
Chu, Chris C (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257SE23098, C257S686000, C257S706000, C257S712000, C257S723000, C438S108000, C438S109000, C361S760000
Reexamination Certificate
active
07576432
ABSTRACT:
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.
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Kim Sarah E.
List R. Scott
Mahajan Ravi
Maveety James G.
Myers Alan M.
Chu Chris C
Intel Corporation
Trop Pruner & Hu P.C.
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