Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – With contact or metallization configuration to reduce...
Reexamination Certificate
2011-08-09
2011-08-09
Mandala, Victor (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
With contact or metallization configuration to reduce...
C257S679000, C257S690000, C257S691000, C257SE23141, C257SE23176
Reexamination Certificate
active
07994604
ABSTRACT:
One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit a signal using proximity communication. A layer of fill metal is located in proximity to this array of transmission pads, wherein the layer of fill metal is “floating” (e.g., not connected to any signal). Leaving this layer of fill metal floating reduces the parasitic capacitance for the array of transmission pads, which can reduce the amount of power needed to transmit the signal.
REFERENCES:
patent: 2009/0176450 (2009-07-01), Chow et al.
patent: 2009/0189674 (2009-07-01), Chow et al.
patent: 2009/0205850 (2009-08-01), Chow et al.
patent: 2009/0279341 (2009-11-01), Forrest et al.
patent: 2009/0279571 (2009-11-01), Chow et al.
patent: 2010/0213606 (2010-08-01), Krishnamoorthy et al.
Chow Alex
Drost Robert J.
Ho Ronald
Proebsting Robert
Proebsting, legal representative Arlene
Mandala Victor
Oracle America Inc.
Park Vaughan Fleming & Dowler LLP
Spiller Mark
LandOfFree
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